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Request an Instant Quote for Part 5306 1J 883B of Mmi Amd with NSN 5962012494638

Part Number: 5306 1J 883B

NIIN : 012494638

Alternate P/N: 53061J883B

Item Name : Microcircuit Memory

Manufacturer: Mmi Amd

CAGE Code : 50364

NSN : 5962-01-249-4638

FSC : FSC 5962 Microcircuits Electronic

If you are in need of parts such as 5306 1J 883B described as Microcircuit Memory from Mmi Amd, look no further than ASAP Inventory. As a wholly-owned subsidiary of ASAP Semiconductor, we have access to an inventory of more than two billion new and obsolete parts and components such as 5306 1J 883B and many more. ASAP Inventory is an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, guaranteeing that each part you purchase from us is fully traceable or comes directly from the manufacturer. Anything not in our inventory can be tracked down and shipped to you with short lead times and competitive prices through our vast and diverse international supply chain network that spans North America and Europe. 5306 1J 883B

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Our website offers parametric search capabilities allowing our customers to search for parts through a number of filters, one of which is by National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. ASAP Inventory has a broad selection of NSN parts 5306 1J 883B such as 5962012494638 from manufacturers like Mmi Amd. To begin the purchasing process immediately, submit an RFQ today.

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NSN Information for Part Number 5306 1J 883B with NSN 5962-01-249-4638, 5962012494638

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-249-4638 Item Description: Microcircuit Memory	5962	012494638	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
5306 1J 883B	2	1	5

Characteristics Data of NSN 5962-01-249-4638, 5962012494638

MRC	Criteria	Characteristic
ABKW	OVERALL HEIGHT	0.290 INCHES MINIMUM AND 0.380 INCHES MAXIMUM
ADAT	BODY WIDTH	0.302 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	614.4 MILLIWATTS
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	BURN IN AND BIPOLAR AND HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND 3-STATE OUTPUT
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQZP	INPUT CIRCUIT PATTERN	10 INPUT
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
CZER	MEMORY DEVICE TYPE	ROM
TTQY	TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
ABMK	OVERALL WIDTH	0.300 INCHES MINIMUM AND 0.395 INCHES MAXIMUM
ADAQ	BODY LENGTH	0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

Corresponding National Stock Number to 5306 1J 883B

530-00-322	530-00-322	530-00-322	530-000
530 000	530-000-001L000	530-000-001L999	530-000-005L000
530-000-005L999	530-000-2-1-5PF	530-000-2-1-5PF	530-000-2-1-5PF
530 000009 000	530-000009-002	530-000009-007	530-000029-000
530-000036-000	530-000064-000	530-000090-000	530-000095-000